A) Tantalum powder is processed into tantalum billet by static pressure forming.
B) the tantalum billet is sintered and then rolled. The tantalum target is formed by heat treatment. And the target is got by the method of powder metallurgy. It has the advantages of high purity, small grain size and uniform recrystaliztion structure. After the process of pressure processing and heat treatment, the powder is formed which meets the requirements of the tantalum targets used in the high-end sputter machine.
Shape 1: Monolithic Rotary, Rotatable Sputtering Target
Dimension: OD(mm) 50-300, ID(mm) 30-280, Length(mm) 100-4000
Shape 3: Circular Targets
Dimension: Diameter 25mm up to 400mm x Thickness 3mm up to 28mm
Purity: 99.9%, 99.95%, 99.99% or 99.995%
Shape 2: Rectangular Targets
Dimension: Thickness 1mm up to 12.7mm x Width up to 600mm x Length up to 2000mm