A processing device for a tantalum ring fixed component comprises: a main body in the shape of a cylinder, the center area of which is provided with a cylinder; The cylindrical top surface of the main body comprises a raised first cutting body and a second cutting body. The height difference between the front end of the first cutting body and the second cutting body forms the first cutting face and the second cutting face. By applying the technical scheme provided by the embodiment of the invention, the cylinder arranged in the processing device can match the depression area in the center of the tantalum ring fixed component, and the area of a single cutting surface can be reduced by the first cutting face and the second cutting face, so as to reduce the wear or damage of the processing device and reduce the processing cost; At the same time, when processing the groove of tantalum ring fixed component, there is no need to change the processing device frequently, which can improve the processing efficiency.
The electrode film on the surface of semiconductor structure is usually formed by sputtering method. Sputtering is a kind of physical vapor deposition (PVD) coating method, which is the process of bombarding the target with charged particles, causing surface atom collision and energy and momentum transfer, and target atom escape from the surface and deposit on the substrate. Metal, alloy or dielectric films can be formed on the substrate surface by sputtering process. Since the direction of charged particles bombarding the target is uncertain, the directivity of the target atoms escaping from the surface of the target is poor, that is, the target atoms will break away from the surface of the target from various angles and then reach the substrate surface in a straight line, thus making the target atoms have poor covering ability on the bottom and side wall of the inner contact hole or through hole of the substrate surface. And the ability to cover the side wall of the step is also very poor, so in order to get a better coverage effect on the bottom and side wall of the contact hole or through hole and the side wall of the step, usually using collimating sputtering.
Tantalum ring fixing components are generally made of tantalum metal, which is very hard with a hardness of up to 6-6.5, making it difficult for mechanical processing. The industry does not design special processing devices for tantalum ring fixing components, but uses tools for processing common metal materials. The grooves in the fixed tantalum ring components are processed by the outer circle turning and the inner circle turning in turn on the lathe. Due to the large cutting area, it is easy to cause tool wear or break, resulting in higher processing cost, and the need to frequently replace the processing tool, resulting in low processing efficiency. The purpose is to provide a processing device for tantalum ring fixed components, so as to solve the problems of high processing cost and low processing efficiency in the existing tantalum ring fixed components processing schemes.
