In the process of thin film deposition, tantalum targets act as the source of raw materials. Through ion bombardment or other energy input methods, the surface of tantalum targets will be evaporated or sputtered, and the generated tantalum atoms or molecules will propagate in gaseous form in a vacuum environment and eventually deposit on the target substrate. These films are typically used to enhance the functionality of the surface, such as improving wear resistance, corrosion resistance, electrical conductivity or optical properties.
Specifically, in physical vapor deposition (PVD), tantalum targets are commonly used in Sputtering deposition (Sputtering) and Evaporation deposition (Evaporation) processes. The high energy input of these processes enables tantalum atoms to fly towards the substrate at high speed, thereby forming a dense and uniform film. In chemical vapor deposition (CVD), the evaporation and reactivity of tantalum targets enable the formation of chemically tightly bonded films on the substrate surface.
The internal structure and uniformity of tantalum targets are crucial to their stability and consistency in thin film deposition. Quality control measures include:
Microstructure analysis: The grain structure and phase distribution of tantalum targets were examined using an electron microscope.
Mechanical property testing: Measuring the hardness, strength and ductility of materials to ensure they can work stably under high stress conditions.
Uniformity assessment: By testing various parts of the target material, ensure the consistency of density and composition.
