Tantalum Target

  • Tantalum target
  • Ta target

Product Details

Tantalum Target Production Technology

  • A) Tantalum powder is processed into tantalum billet by static pressure forming.

  • B) the tantalum billet is sintered and then rolled. The tantalum target is formed by heat treatment. And the target is got by the method of powder metallurgy. It has the advantages of high purity, small grain size and uniform recrystaliztion structure. After the process of pressure processing and heat treatment, the powder is formed which meets the requirements of the tantalum targets used in the high-end sputter machine.

Product Name: Tantalum Target, Tantalum Sputtering Target
Material: Tantalum

  • Shape 1: Monolithic Rotary, Rotatable Sputtering Target
    Dimension: OD(mm) 50-300, ID(mm) 30-280, Length(mm) 100-4000

  • Shape 3: Circular Targets
    Dimension: Diameter 25mm up to 400mm x Thickness 3mm up to 28mm
    Purity: 99.9%, 99.95%, 99.99% or 99.995%

  • Shape 2: Rectangular Targets
    Dimension: Thickness 1mm up to 12.7mm x Width up to 600mm x Length up to 2000mm

Tantalum Sputtering Target Grade, Specialty and Application
Products Characteristics and Application
Ta3N5 High purity, used as the sputtering deposition coating for the optical fiber of the electronics industry
Ta4N High purity, used as the sputtering deposition coating for the semiconductor chip
Ta4N5 High purity, used as the sputtering deposition coating for the integrated circuit of the electronics industry
Tantalum Supttering Target Specification and Tolerance
Products Thickness/mm Tolerance/mm Diameter/mm Tolerance/mm Flatness/mm·mm-1 Roughness (Ra) /μm
Ta3N5 6.35 + 0.254 / - 0 152.4 + 0.254 / -0.0 0.254 0.8
6.35 + 0.254 / - 0.254 304.8 + 0.254 / - 0.254 0.381 0.8
11.47 + 0.51 / - 0.0 298.45 + 0.51 / - 0.0 0.381 0.8
12.7 + 1.27 / - 0.0 654.05 + 1.27 / - 0.0 0.508 0.8
Ta4N 7.62 + 0.762 / - 0.0 322.58 + 1.02 / - 0.0 0.381 0.8
10.16 + 0.076 / - 0.076 781.05 + 0.076 / - 0.076 0.762 0.8
Ta4N5 7.88 + 0.762 / - 0.0 494.03 + 1.02 / - 0.0 0.381 0.8
We can follow customer's requested tolerance to produce products. 

Tantalum Target Application

Tantalum target material is mainly used in optical fibers, semiconductor wafer and integrated circuit of sputtering deposition coating. It can also be used for the cathode sputtering coating, high vacuum suction active material, etc. Tantalum target is an important material with thin film technology. The target can be used for high temperature alloys as blades and blades for a jet turbine disc. We produce R05200, R05400, R05255, R05252, R05240 targets which meet ASTM B708 and we can also make targets according to customer’s drawings.
Tantalum target application

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