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Alloy material Target
In sputtering coating, can be as simple as the use of electronic or high-energy laser bombardment of target, and the surface components form groups of atoms, or ions was sputtering, and eventually deposited on the substrate surface, experience the film-forming process, ultimately form a thin film.

The sputtering coating can be divided into many kinds. In general, the difference with evaporation coating is that the sputtering rate will be one of the main parameters. Sputtering coating of laser sputtering coating PLD, composition uniformity, easy to maintain, and the thickness of the atomic scale relatively poor uniformity (because is pulsed sputtering), the growth of the crystal (outer) to control is more general.

In sputtering coating, can be as simple as the use of electronic or high-energy laser bombardment of target, and the surface components form groups of atoms, or ions was sputtering, and eventually deposited on the substrate surface, experience the film-forming process, ultimately form a thin film.

The sputtering coating can be divided into many kinds. In general, the difference with evaporation coating is that the sputtering rate will be one of the main parameters. Sputtering coating of laser sputtering coating PLD, composition uniformity, easy to maintain, and the thickness of the atomic scale relatively poor uniformity (because is pulsed sputtering), the growth of the crystal (outer) to control is more general.

1. The target Ti metal target material: titanium, aluminum target Al target Su, hafnium target Hf, lead, tin, target target target Ag, Ni, Ag, Pb, Ni selenium target Se, beryllium target Be, tellurium target Te target target V C, vanadium and carbon target In target Sb, indium, antimony, manganese, boron target and tungsten target B W target target target Cu Bi, Cu, Mn, bismuth silicon target target Ta Si, tantalum target Mg target zinc, magnesium, zinc, zirconium target target Cr, Zr, Cr stainless steel target S - S target Nb target Mo, cobalt, molybdenum, niobium target target Fe, Co, Fe target Ge Ge, etc...
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