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Firmetal is recognized as the innovative expert in deformation processing and property control of tantalum. Our tantalum sputtering products are preferred for the fabrication of sputtering targets for:
Magnetic storage media
Inkjet print heads
Microelectronics devices, microprocessors and memory chips
Why is sputtering-grade tantalum by Firmetal always your best choice?
Quality
The largest diameter, highest purity tantalum ingots in the world using a triple electron beam melting process
Unique process produces the most chemically, metallurgically and mechanically consistent tantalum available
Uniform microstructure and texture for predictable and consistent sputtering performance over the life of the target
Metallurgical Properties
Microstructure consists of a uniform, equiaxed grain structure, void of bands of unrecrystallized material
Fully recrystallized grain size of 100 microns or less
Ultrafine grain target is greater than 98% recrystallized and has a grain size of less than 50 microns
Texture
Tantalum Purity (ppm) |
Impurities |
5N Ta |
4N5 Ta |
4N Ta |
3N5 Ta |
Fe |
<1 |
<1 |
<1 |
<5 |
Ni |
<1 |
<1 |
<1 |
<5 |
Cr |
<1 |
<1 |
<1 |
<5 |
Cu |
<1 |
<1 |
<1 |
<5 |
Nb |
<10 |
<50 |
<100 |
<500 |
W |
<8 |
<25 |
<80 |
<150 |
Mo |
<5 |
<25 |
<50 |
<100 |
Na |
<0.4 |
<0.4 |
<1 |
<5 |
Li |
<0.1 |
<0.1 |
<1 |
<5 |
K |
<0.4 |
<0.4 |
<1 |
<5 |
U |
<0.001 |
<0.005 |
<0.005 |
<0.005 |
Th |
<0.001 |
<0.005 |
<0.005 |
<0.005 |
Others |
<0.1 |
<1 |
<5 |
<10 |
C |
<30 |
<40 |
<40 |
<50 |
O |
<80 |
<80 |
<100 |
<100 |
N |
<30 |
<40 |
<40 |
<50 |
H |
<5 |
<10 |
<10 |
<10 |
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